Electrodeposition of Copper for Three-Dimensional Metamaterial Fabrication
By Yang, Shendu; Thacker, Zachary; Allison, Evan; Bennett, Megan; Cole, Nicholas; Pinhero, Patrick J.
Published in ACS Applied Materials & Interfaces
2017
Abstract
Metamaterials typically consist of metallic and dielectric repeating structures. Electrodeposition of copper is the preferred approach to fabricating the metallic part of the metamaterials of interest in this study. The highly variant topography requires chemical additives, like chloride ions, 3-mercapto-1-propanesulfonic acid (MPSA), polyethylene glycol (PEG), and polyvinylpyrrolidone (PVP) to enhance bottom-up superfilling while maintaining terrace flatness. This study focuses on both experimental and computational investigations of the degradation potential of the additives and their adsorption mechanism in a highly acidic copper electrolyte in order to optimally parametrize the copper electrodeposition process. Results show Cl
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