Electrodeposition of porous copper as a substrate for electrocatalytic material
By Singh, Himanshu; P.B, Dheeraj; Singh, Yash Pratap; Rathore, Gaurav; Bhardwaj, Mukesh
Published in Journal of Electroanalytical Chemistry
NULL
2017
Abstract
Abstract Porous copper was electrodeposited using hydrogen bubble dynamic template. Various electrolytes having CuSO4 and {H2SO4} in fixed molar ratio approximately equal to 0.3 and at temperature 18
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