Evaluation of the corrosion performance of Cu
By Adeline B.Y. Lim and Wei Jian Neo and Oranna Yauw and Bob Chylak and Chee Lip Gan and Zhong Chen
Published in Microelectronics Reliability
NULL
2016
Abstract
Copper wire has become a mainstream bonding material in fine-pitch applications due to the rising cost of gold wire. In recent years, palladium-coated copper (Pd
Microsoft is Ending Support for Windows 7
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