The description of the copper deposition/dissolution process in ammonia buffer with the application of mathematical two-plate model
By Skitał ‚, Piotr M.; Sanecki, PrzemysLaw T. & GibaLa, Katarzyna
Published in Electrochimica Acta
NULL
2014
Abstract
The experimental Cu2+/Cu+/Cu0 system in ammonia buffer (pH = 9.25) has been investigated by cyclic voltammetry method and described by the advanced two-plate model with BET adsorption equation. A change of electrode properties during electrode process is included into the applied model. The model reproduces four one-electron peaks of electronation/deelectronation process together with a characteristic loop on cathodic part of CV response and covers 0.1; 0.2, 0.5; 1; 2; 5; 10; 20; 50 mM concentrations of Cu2+ at scan rate range 0.05–5 V/s. The values of elementary kinetic parameters have been determined, validated and discussed. It has been proved that CV technique and two-plate model is adequate to cover complete description of the deposition process for the wide range of concentration. The parameters of applied BET adsorption model coupled with kinetic parameters of electrochemical process model have been extensively discussed.
Microsoft is Ending Support for Windows 7
Microsoft will discontinue support for Windows 7 on January 14, 2020 which means Gamry will also be discontinuing support for Windows 7. If you are upgrading to Windows 10, like many companies and institutions, you need to be running Version 7 of our s oftware . Please note that only USB and Ethernet-based instruments can run in Version 7. Eligible users can download the latest version of our software through our online Client Portal .
If you haven't already registered your instrument, you can do so through the Client Portal .
Please email Technical Support if you have any questions regarding this transition. Please be sure to include your instrument model and serial number when contacting us.