Cyclic Voltammetric Synthesis of Poly(N-methyl pyrrole) on Copper and Effects of Polymerization Parameters on Corrosion Performance

By Duran, Berrin & Bereket, Gözen
Published in Industrial & Engineering Chemistry Research NULL 2012

Abstract

In the present work, we report the cyclic voltammetric synthesis of poly(N-methyl pyrrole) films onto copper surface from aqueous solutions of N-methyl pyrrole and oxalic acid. The effects of electropolymerization parameters (applied potential, scan rate, and cycle number) on the protective properties of poly(N-methyl pyrrole) films have been systematically investigated, and it was shown that protection efficiency strongly depends on the electrodeposition parameters. Nanoscale coatings electrodeposited at optimum electrochemical conditions were characterized by cyclic voltammetry, ex-situ attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) and scanning electron microscopy (SEM) studies. The performance of poly(N-methyl pyrrole) as protective coating against corrosion of copper in 0.1 M H2SO4 solution was assessed by electrochemical impedance spectroscopy (EIS) and anodic polarization techniques. Corrosion test results demonstrated that the poly(N-methyl pyrrole) coating has ability to protect the copper in acid rain corrosive media during 12 days and the protective behavior of the polymer film results from self-healing effect of the coating against the attack of the corrosive environment.

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