Effects of ionic liquid additive [BMIM]HSO4 on copper electro-deposition from acidic sulfate electrolyte
By Zhang, Q.B.; Hua, Y.X.; Wang, Y.T.; Lu, H.J. & Zhang, X.Y.
Published in Hydrometallurgy
NULL
2009
Abstract
The effect of a new ionic liquid additive 1-butyl-3-methylimidazolium hydrogen sulfate-[BMIM]HSO4 on the kinetics of copper electro-deposition from acidic sulfate solution was investigated by cyclic voltammetry, polarization and electrochemical impedance measurements and compared with those exerted by the conventional additive, thiourea. Results from cyclic voltammetry and kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, indicated that [BMIM]HSO4 had a pronounced inhibiting effect on Cu2+ electro-reduction and led to more leveled and fine-grained cathodic deposits. In addition, [BMIM]HSO4 was found to inhibit the charge transfer and slightly change the copper electro-deposition mechanism compared to the absence of additives. Data obtained from X-ray diffraction spectra revealed that the presence of these additives did not change the crystal structure of the electro-deposited copper but strongly affected the crystallographic orientation of the crystal planes.
Microsoft is Ending Support for Windows 7
Microsoft will discontinue support for Windows 7 on January 14, 2020 which means Gamry will also be discontinuing support for Windows 7. If you are upgrading to Windows 10, like many companies and institutions, you need to be running Version 7 of our s oftware . Please note that only USB and Ethernet-based instruments can run in Version 7. Eligible users can download the latest version of our software through our online Client Portal .
If you haven't already registered your instrument, you can do so through the Client Portal .
Please email Technical Support if you have any questions regarding this transition. Please be sure to include your instrument model and serial number when contacting us.